回流焊技术资料
回流焊参数技术资料
Lead-free Reflow Soldering Condition
A. 回流焊条件推荐
Recommended Conditions for Reflow Soldering
（1）应采用红外线及热风回流焊接，不宜采用汽相加热回流焊接；
A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and vapor heat transfer systems (VPS) are not recommended.
（2）推荐回流焊只进行一次，回流焊次数如果需要二次，必须相隔30分钟以上；
Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30 minutes must be layout between each time.
（3）无铅回流焊，请符合下述条件：
For lead-free type reflow soldering, please observe proper conditions below:
a)从150℃至200℃的预热时间在t1秒钟以内；
The time of preheating from 150°C to 200°C shall be within maximum t1 seconds;
b)电容器顶部温度超过217℃的焊接时间不超过t2秒；
The time of soldering temperature at 217°C measured on capacitors' top shall not exceed t2 (second);
c)电容器顶部尖峰温度不超过Tp℃，在5℃范围内的实际尖峰温度时间不超过t3秒
The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C of actual peak temperature shall not exceed t3 (second).
B. 回流焊曲线图
Classification Reflow Profile
|
*1. Average ramp-up rate is 3℃/second max. *2. Ramp-down rate is 6℃/second max. *3 .Time from 25℃ to peak temperature is 8 minutes max. |
C. 尖峰温度允许范围
Allowable Range of Peak Temperature
|
Size |
Thickness (mm) |
TP(°C) |
t1(Max,secs) |
t2(Max,secs) |
t3(TP,secs) |
|
Æ4~Æ6.3 |
³2.5 |
260 |
120 |
90 |
5 |
|
Æ8 |
³2.5 |
240 |
100 |
60 |
5 |
|
Æ10 |
³2.5 |
235 |
100 |
40 |
5 |
D. 表面安装推荐尺寸
Recommended Land Size (Unit: mm)
|
Size |
X |
Y |
a |
|
Æ4 |
1.6 |
2.6 |
1.0 |
|
Æ5 |
1.6 |
3.0 |
1.4 |
|
Æ6.3 |
1.6 |
3.5 |
2.1 |
|
Æ8 |
2.5 |
3.5 |
3.0 |
|
Æ10 |
2.5 |
4.0 |
4.0 |
